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Cortex-M4 MCU CC3200 WLAN / Wi-Fi Module RF-WM-3200B1

  • CC3200 WLAN / Wi-Fi Module RF-WM-3200B1
  • CC3200 WLAN / Wi-Fi Module RF-WM-3200B1
  • CC3200 WLAN / Wi-Fi Module RF-WM-3200B1
  • CC3200 WLAN / Wi-Fi Module RF-WM-3200B1

Cortex-M4 MCU CC3200 WLAN / Wi-Fi Module RF-WM-3200B1

RF-WM-3200B1 Wi-Fi module is working at 2.4 GHz frequency and aimed at the low power consumption IoT applications.

  • P/N:

    RF-WM-3200B1

  • SoC:

    CC3200

  • Processor:

    ARM® Cortex™-M4 at 80 MHz

  • Protocols:

    Wi-Fi 2.4 GHz

  • Working Frequency:

    2401 MHz ~ 2484 MHz

  • Package (mm):

    31.0 × 20.0 × 2.8, half-hole, 1.52 pitch, 36-pin

  • Features:

    802.11bgn, IPv4, 2 secure sockets, 1 STA, three RF output modes

  • GPIO:

    27

  • Max. TX Power:

    +17 dBm (11 Mbps @ CCK)

  • Transmission Range:

    300 m
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RF-WM-3200B1 is a Wi-Fi module based on TI SimpleLink CC3200 wireless MCU. The module integrates the high-performance ARM® Cortex™-M4 MCU in IC, the crystals, the filter and an option of RF output modes. The high integration allows the customer to develop an entire application with a single module. This WLAN module supports a series of subsystems including 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. It can work under AP (access point) mode, STA (station) mode and Wi-Fi Direct mode. The users can use this module to do applications involving WPA2 personal and enterprise security and WPS 2.0. The module embedded several stacks for your development: TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols.


Features of TI SimpleLink CC3200 WLAN module


- Applications -

· Cloud Connectivity 

· Internet Gateway

· IP network sensor nodes 

· Security Systems

· HVAC

· Smart Plug

Applications of TI SimpleLink CC3200 WLAN module

Wireless SoC:


  • 80 MHz ARM® Cortex®-M4 processor
  • TX power:
    • +17 dBm (IEEE 802.11 B, 11 Mbps @ CCK)
    • +13 dBm (IEEE 802.11 G, 54 Mbps @ OFDM)
    • +12 dBm (IEEE 802.11 N, HT20 @ MCS7)
  • Sensitivity: 
    • -80 dBm (IEEE 802.11 B, 11 Mbps @ CCK)
    • -69 dBm (IEEE 802.11 G, 54 Mbps @ OFDM)
    • -67 dBm (IEEE 802.11 N, HT20 @ MCS7)
  • Memory
    • 1 MB flash
    • 256 kB RAM
  • Application Throughput:
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Security:
    • AES, DES, and 3DES
    • SHA2 and MD5
    • CRC and Checksum


Wi-Fi Network Processor Subsystem：


  • Featuring Wi-Fi internet-on-a-chipTM 
  • Dedicated ARM MCU
    • Completely offloads Wi-Fi and internet protocol from the application microcontroller
  • Wi-Fi and internet protocols in ROM
  • 802.11 b/g/n radio, baseband, medium access control (MAC), Wi-Fi driver, and supplicant
  • TCP/IP stack
    • Industry-standard BSD socket APIs
    • 8 simultaneous TCP or UDP sockets
    • 2 simultaneous TLS and SSL sockets
  • Powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bits AES encryption for TIS and SSL connections
  • Station, AP, and Wi-Fi direct® modes
  • WPA2 personal and enterprise security
  • SimpleLink connection manager for autonomous and fast Wi-Fi connections
  • SmartConfigTM technology, AP mode, and WPS2 for easy and flexible Wi-Fi provisioning

Operating Range:


  • Supply voltage range 2.1 V ~ 3.6 V
  • Working temperature range: -40 °C ~ +85 °C
  • Frequency: 2401 MHz ~ 2484 MHz


Rich Peripherals:


  • Parallel camera
  • McASP
  • I²S
  • SD/MMC
  • UART
  • SPI
  • I²C
  • PWM
  • ADC


Certificate:


  • RoHS


TI CC32xx Series Wi-Fi Modules
Part Number RF-WM-3235B1S RF-WM-3235A1S RF-WM-3235B1 RF-WM-3235A1 RF-WM-3220B1 RF-WM-3200B3 RF-WM-3200B1
Photo
IC CC3235S CC3235S CC3235SF CC3235SF CC3220SF CC3200 CC3200
Core 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4 80 MHz ARM® Cortex®-M4
Antenna Pad PCB/Pad Pad PCB/Pad Chip/IPEX/Pad Pad Chip/IPEX/Pad
RAM 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
Flash 4 MB (Module Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (IC Embedded) 4 MB (Module Embedded) 1 MB (Module Embedded) 1 MB (Module Embedded)
Protocols 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 a/b/g/n: 2.4 GHz and 5 GHz 802.11 b/g/n: 2.4 GHz 802.11 b/g/n: 2.4 GHz 802.11 b/g/n: 2.4 GHz
Power Supply 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V 2.7 V ~ 3.6 V, recommend to 3.3 V
Frequency Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 120 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Shutdown: 1 µA Hibernate: 4.5 µA Low-power deep sleep (LPDS): 135 µA Idle connected (MCU in LPDS): 710 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 223 mA Hibernate: 4.0 µA Low-power deep sleep (LPDS): 250 µA Idle connected (MCU in LPDS): 825 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 229 mA Hibernate: 4.0 µA Low-power deep sleep (LPDS): 250 µA Idle connected (MCU in LPDS): 825 µA RX traffic (MCU active): 59 mA TX traffice (MCU active): 229 mA
Max. TX Power +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18.0 dBm @ 2.4 GHz (1 DSSS) +18.1 dBm @ 5 GHz (6 OFDM) +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM +18 dBm @ 1 DSSS +14.5 dBm @ 54 OFDM
Receiving Sensitivity -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @2.4 GHz (1 DSSS) -92 dBm @5 GHz (6 OFDM) -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM -96 dBm @ 1 DSSS -74.0 dBm @ 54 OFDM
Security WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise, WPA3™ Personal, Crypto Engine: (AES, DES, SHA/MD5, CRC) WPA2 Personal and Enterprise Security: WEP, WPA™/ WPA2™ PSK, WPA2 Enterprise (802.1x), Crypto Engine: AES, DES, 3DES, SHA2, MD5, CRC, and Checksum; Secure Sockets (SSLv3, TLS1.0, TLS1.1, TLS1.2) Crypto Engine: AES, DES, and 3DES, SHA2 and MD5, CRC and Checksum Crypto Engine: AES, DES, and 3DES, SHA2 and MD5, CRC and Checksum
Peripheral PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, UART, I2S, I2C, SPI, SD, ADC, 8-bit parallel interface PWM, McASP, UART, I2S, I2C, SPI, SD/MMC, ADC, 8-bit parallel camera interface PWM, McASP, UART, I2S, I2C, SPI, SD/MMC, ADC, 8-bit parallel camera interface
GPIO 27 27 27 27 27 27 27
Working Temperature -40 ℃ ~ +85 ℃ -40 ℃ ~ +105 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃ -40 ℃ ~ +85 ℃
Storage Temperature -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃ -55 ℃ ~ +125 ℃
Transmission Range 200 m (external PCB antenna) 150 m 200 m (external PCB antenna) 150 m 100 m (Chip antenna) 200 m (external PCB antenna) 100 m (Chip antenna)
Dimension (mm) 20.5 x 17.5 x 1.7 25.0 x 20.5 x 2.3 20.5 x 17.5 x 1.7 25 x 20.5 x 2.3 31.0 x 20.0 x 2.3 20.5 x 17.5 x 2.3 31.0 x 20.0 x 2.3
Package LGA LGA LGA LGA 1.27-mm pitch half-hole LGA 1.27-mm pitch half-hole
Functions Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODS Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODAS Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODSF Dual frequency Wi-Fi, Low-power 5G, Compatible with TI CC3232MODASF Multiple antenna output modes Lower power consmption, Compatible with TI CC3200MOD Lower power consmption, Support AT commands
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