Who is RF-star
Wireless Creates Infinite Possibilities RF-star, as a forerunner in wireless IoT arena, has the vision of a connected world with widely deployed IoT technology, such as BLE, Wi-Fi, LoRa, ZigBee, Thread, Matter, Wi-SUN, Sub-1GHz, etc. We engage ourselves in embedded hardware & software design; APP development; IoT cloud platform development service; test & certification; OEM & ODM. RF-star is aimed to empower industries to run intelligently and providing people a better lifestyle. Our solutions are gradually applied in the fields — from consumer electronics to medical electronics, automated manufacturing to smart logistics, and smart home to smart agriculture. What’s more, RF-star is highly praised by industry leaders such as Texas Instruments, Nordic Semiconductor, Silicon Labs, Realtek, ATmosic and ASR, which makes RF-star a more and more bright future. HISTORY From 2010 to 2021, we are forging ahead......
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Wireless Modules
A broad portfolio of self-developed wireless RF products, like Bluetooth modules, Wi-Fi modules, ZigBee modules, Sub-1G modules, Matter modules, Wi-SUN modules and so on, help you to build an IoT world. 
Applications
Various IoT solutions with RF-star full-fledged wireless RF modules and specialized services are widely applied to these fields including industrial IoT, intelligent logistics, smart homes and more.
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our partners
With the full support of leading IC manufacturers, we have become a one-stop wireless solution supplier AND are highly recognized by partners at home and abroad.
Why choose us?

Why choose us?

Established in 2010, with a decade’s wireless IoT module experience, RF-star is the company that can help you to identify your project requirements, select the most suitable wireless option and achieve the success of the project.
  • 10+ YEAR Experience 10+ YEAR Experience
    RF-star has been providing wireless IoT modules for thousands of projects since 2010.
  • Better Support Better Support
    One-to-one technical supports enable the shortest lead time in design and development.
  • Quick Response Quick Response
    The profession allows us to know your needs efficiently and give technical responses quickly.
  • Support Customization Support Customization
    The module customization based on the diversification of the end-products is available.
Latest News
Stay up to date on company news, industry trends and IoT blogs and other module resources by RF-star.
Company News
RF-star Unveils Upcoming RF-TI1354P1 Wi-SUN Module for Large-Scale IoT Networks
Aug 06, 2024 RF-star Unveils Upcoming RF-TI1354P1 Wi-SUN Module for Large-Scale IoT Networks
RF-star, a leading global manufacturer of wireless modules, announces the upcoming release of its highly anticipated RF-TI1354P1 Wi-SUN module. Scheduled for launch in August, this innovative module based on TI CC135410 SoC, is poised to empower large-scale IoT deployments with its multiprotocol, dual-band capabilities, catering to the growing demands of smart cities, smart energy, grid infrastructure and industrial IoT sectors. Figure 1 RF-TI1354P1 Wi-SUN Module Is Coming Soon The RF-TI1354P1 module, promises to deliver a robust performance with wireless bands of 800 MHz - 928 MHz and 2.4 GHz. It can coexist and operate concurrently in multiple wireless stacks, eg. Bluetooth Low Energy 5.3, Matter, Thread, Wi-SUN, Zigbee protocol through a DMM driver. Equipped with 1024 kB Flash and 288 kB RAM, the Sub-1GHz transceiver is designed to operate as a border router, extending its reach to up to 300 border router nodes. In a mesh network, each device can establish multiple and robust connections with nearby devices. Its self-healing and self-configuration capacities provide a more robust network and reduced downtime for the thousands of connected nodes. This feature is particularly advantageous for complex, distributed IoT applications that require extensive connectivity and reliable data transmission. Figure 2 Wi-SUN mesh network topology “The introduction of the RF-TI1354P1 module marks a new era in IoT connectivity,” said Ben Qiu, GM of RF-star. “Its extensive nodes within a network will greatly enhance the scalability and flexibility of IoT solutions, making it ideal for smart city, grid infrastructures and industrial applications.” The RF-TI1354P1 module is expected to build upon the success of RF-star's existing Wi-SUN modules, including the RF-SM-1277B1 and RF-TI1352P2, which have already established a strong reputation for their low power consumption, high data throughput, and ease of deployment. The new module's dual-band capability and extended node support will further solidify RF-star's position at the forefront of IoT wireless communication technology. Figure 3 RF-star’s Wi-SUN Modules Support Border Router Node, Router Node, Leaf Node. As the global Wi-SUN technology market is predicted to grow at a CAGR of 13.45% between 2024-2032, the RF-TI1354P1 module's release could not be timelier. It aligns with the market's shift towards more interconnected and intelligent systems, particularly in the realms of smart cities and energy management. RF-star's dedication to innovation is evident in its development of high-performance Wi-SUN modules, which are set to empower a new wave of IoT applications. These advancements aim to enhance connectivity efficiency, reduce costs, and ultimately improve the user experience. For more information on RF-star and its upcoming Wi-SUN module, please visit www.rfstariot.com About RF-star Shenzhen RF-star Technology Co., Ltd (RF-star) is a leading global provider of wireless communication modules and solutions, ...
RF-star Launches Bluetooth UART Protocol for CC2652P High-Power BLE Modules RF-BM-2652P2/P2I
Jul 11, 2024 RF-star Launches Bluetooth UART Protocol for CC2652P High-Power BLE Modules RF-BM-2652P2/P2I
Shenzhen RF-star Technology Co., Ltd. (RF-star), a leading wireless module manufacturer, has released its latest Bluetooth UART transparent transmission protocol for CC2652P-based BLE modules RF-BM-2652P2 and RF-BM-2652P2I. This new offering is set to revolutionize the landscape ofhigh-power Bluetooth Low Energy (BLE) modules, by providing developers with robust, long-range wireless solutions tailored for multi-connectivity needs. Enhanced Connectivity with High-Power BLE Modules BLE technology, renowned for its low power consumption and ease of use, has long been a cornerstone of short-range wireless communication. However, as the demand for long-range connectivity in smart home and industrial automation applications grows, the need for high-transmit power BLE devices has become increasingly apparent. RF-star's CC2652P modules, RF-BM-2652P2 and RF-BM-2652P2I, feature a built-in power amplifier with a maximum transmit power of +20 dBm. This extends the transmission range from the conventional 10 meters to hundreds of meters. The New Era of Bluetooth UART Transparent Transmission The introduction of Bluetooth 5.0 transparent transmission protocol -- essentially a serial port protocol -- is excellent news for developers. Equipped with this protocol, the modules can work in BLE master mode, slave mode, master-slave mode, and Beacon mode. Here are some standout features (AT commands) that make these modules a must-have for high-power applications: Adjustable Transmit Power: With 22 levels of transmit power adjustment ranging from -20 dBm to +20 dBm, developers can fine-tune the output power to suit their specific requirements, ensuring optimal performance without unnecessary power consumption. Multi-Device Connectivity: Supporting one-master and multi-slave connections, these modules can handle up to 8 devices simultaneously, making them ideal for complex networks and IoT ecosystems. Extended Broadcast Packets: Customizable extended broadcast packets of up to 251 bytes allow for more data to be transmitted in a single packet, enhancing communication efficiency. High UART Forwarding Rate: A maximum stable UART forwarding rate of 35 KB/s ensures that data transmission is swift and reliable, even in high-traffic scenarios. Observer Mode with A Filter: This feature allows users to monitor and filter specific parameters, offering greater control and deeper insights into the module's operations. Bluetooth Pairing and Bonding Support: Seamless integration with existing Bluetooth ecosystems is facilitated by support for pairing and bonding, ensuring compatibility with a wide range of devices Automatic Reconnection: The automatic reconnection ensures that the module maintains a stable connection, even in the face of temporary disruptions. Multi-Protocol Support: BLE5.2, ZigBee, Thread, etc. Beyond Bluetooth serial port capabilities, the RF-BM-2652P2 and RF-BM-2652P2I modules also support multiple protocols, including Bluetooth 5.2 Low Energy, T...
RF-star's Bluetooth Digital Key Solutions Accelerate Intelligent Vehicle Ecosystem Innovation
Jun 11, 2024 RF-star's Bluetooth Digital Key Solutions Accelerate Intelligent Vehicle Ecosystem Innovation
With the rapid development of automotive intelligence, digital keys are emerging as a global trend. Their deployment will transform travel and user experiences, reshaping the interaction between people and vehicles within the broader ecosystem. Digital keys, enhanced by Bluetooth® technology, transcend simple car access tools and serve as the initial connection in the smart car experience. Today, every new smartphone now comes equipped with Bluetooth digital key-enabling technology. This advancement enables users to seamlessly enjoy keyless entry, starting, locking, and other security features through their smartphones and smart devices. As a leading global provider of wireless modules and solutions, Shenzhen RF-star Technology Co., Ltd. (RF-star) was honored to be interviewed by Lori Lee, APAC Marketing Director of Bluetooth SIG. During the interview, RF-star’s Marketing Manager, Ms. Qianqian Wen, shared valuable insights into the market trends of digital keys and highlighted the pivotal role of Bluetooth technology in the intelligent vehicle ecosystem. Furthermore, we are eagerly anticipating the upcoming release of the Bluetooth Channel Sounding feature, which we believe will significantly enhance the performance of digital key solutions. Bluetooth SIG's Interview with RF-star In recent years, the new energy vehicle market has grown rapidly. How do you view the importance of digital keys and market trends? The digital key serves as the first connection point for users to experience intelligent cars. At this connection point, security, reliability, convenience, and interactive comfort are all indispensable. The success of the digital key experience design is crucial for car user evaluations and plays a key role in deepening the connection with users. With the maturity of technologies like Bluetooth® Low Energy (LE), near-field communication (NFC), and ultra wide band (UWB), digital keys are entering a period of rapid growth, and integrated solutions will become the market mainstream. What are the technological advantages of Bluetooth technology in digital key solutions? RF-star chose Bluetooth® technology to develop car digital key solutions, primarily because of its low power consumption, high reliability, and broad device compatibility. Bluetooth technology provides stable wireless connections and supports various smart devices like smartphones and smartwatches, enabling users to remotely control vehicles through these devices for keyless entry, starting, and other functions. Additionally, Bluetooth technology’s low power consumption helps reduce operating costs. RF-star also values Bluetooth technology’s iterative capabilities. For example, the upcoming channel sounding feature improves the positioning accuracy of Bluetooth Digital Key solutions and protects the system from relay hijacking. It may become a cost-effective preferred technology in the digital key domain in the future. With the upcoming release of the Bluetooth Chann...
RF-star Redefines Automotive Wireless Solutions with New BLE Module Lineup
May 15, 2024 RF-star Redefines Automotive Wireless Solutions with New BLE Module Lineup
RF-star, a leading manufacturer of wireless modules and provider of wireless connectivity solutions, proudly announces the expansion of its Bluetooth module lineup tailored specifically for automotive applications. The latest BLE modules include the RF-BM-2642QB1I and RF-BM-2340QB1, designed to excel in automobile-critical applications such as digital car keys, T-Box, Tire Pressure Monitoring Systems (TPMS), Passive Entry Passive Start (PEPS), and more. Designed to meet the evolving demands of the automotive industry, RF-star's new modules offer a host of features to enhance reliability, durability, security, and ease of integration. Compliance and security assurance are paramount in automotive applications. RF-star’s new Bluetooth Low Energy modules are based on TI chips, specifically the CC2642R-Q1 and CC2340R5-Q1 MCUs meeting Automotive Electronics Council (AEC-Q100) standards. RF-BM-2642QB1I and RF-BM-2340QB1 BLE modules integrated with the automotive-qualified MCUs can operate in Grade 2 temperature range (–40 °C to +105 °C), guaranteeing their reliability and durability in harsh automotive environments. Additionally, RF-star's CC2642R-Q1 and CC2340R5-Q1 modules incorporate AES 128-and 256-bit cryptographic accelerator, ECC and RSA public key hardware accelerator and true random number generator(TRNG). These advanced security enablers with robust encryption protocols and authentication mechanisms, provide peace of mind to both automakers and end-users. Rich resources and ease of use are also taken into consideration by project decision-makers. Their high-performance processor and abundant resources, eg., RF-BM-2340QB1 with 512 kB Flash and 36 kB RAM, offer ample opportunities for firmware development. Meanwhile, they also support over-the-air upgrade (OTA). Besides, the automotive modules feature UART, SPI, I2C, I2S, ADC and more digital peripherals, flexible RF output modes(eg., PCB antenna, IPEX connector and half-hole ANT RF pin), and user-friendly development kits. Hence, it is quite easy to integrate into existing vehicle architectures, especially the auto aftermarket applications. Best of all, both support Bluetooth 5.0 Low Energy serial port transmission for master-slave wireless connections. These rich functions with AT commands streamline the integration process, reducing complexity and accelerating time-to-market for automotive projects. Whether experienced engineers or newcomers to wireless connectivity, they can leverage RF-star's Bluetooth modules easily to unlock their full potential in ongoing projects. RF-star - A powerful supplier with abundant experience stands out among competitors. Certified with ISO9001 and IATF16949 (automotive sector quality management systems), the enterprise and the manufacturer meticulously adhere to international quality management standards. RF-star is also honored as a member of the Car Connectivity Consortium (CCC) and Intelligent Car Connectivity Industry Ecosystem Alliance (ICCE). Beyond indis...
RF-star Showcased CC2340 Bluetooth LE Modules in TI Embedded Innovation Seminar
Dec 01, 2023 RF-star Showcased CC2340 Bluetooth LE Modules in TI Embedded Innovation Seminar
On November 28-30, RF-star, a leading RF wireless modules manufacturer, is honored to present its new CC2340 Bluetooth Low Energy modules and solutions, at the TI Embedded Technology Innovation and Development Seminar (Shanghai and Shenzhen Station) organized by Texas Instruments, a global semiconductor giant. This premier event brought together industry leaders, experts, ecological partners and enthusiasts to explore the latest advancements and opportunities in TI’s new-generation embedded products and applications. As TI’s partner, RF-star was invited to attend the seminar and interacted with industry representatives to discuss the embedded technology trends. In this seminar, Texas Instruments showcased the new Arm® Cortex® -M0+MCU product portfolio, new-generation Sitara AM6x series processors, TI CC2340x Bluetooth LE MCUs and C2000TM Real-Time microcontrollers. TI’s experts also shared Wi-Fi 6 for IoT applications and low-power consumption Radar solutions. The leading wireless innovation, comprehensive embedded processor portfolio, cutting-edge system solutions, easy-to-use platforms and tools would help engineers develop and push their target projects to market quickly. RF-star presented the CC2340R5 wireless modules based on TI Bluetooth Low Energy MCUs in the seminar exhibition hall. RF-BM-2340B1(I), as RF-star’s first CC2340R5 series Bluetooth LE modules features high-quality RF performance, ultra-low power consumption, adequate security and competitive price. BLE5.0 transparent transmission protocol (serial port protocol), rich AT commands, and CE, FCC, BQB certifications, can simplify project development and accelerate the products to market. The CC2340 Bluetooth modules designed by RF-star enable wireless connectivity in building automation, grid infrastructure, medical devices, appliances, personal electronics, retail automation and more applications. The Bluetooth digital key, UWB digital key, T-Box, BMS, TPMS, Bluetooth charging pile and other vehicle solutions embedded RF-star wireless modules attracted attendees to engage in potential business cooperation. In the future, RF-star will explore wireless connectivity innovation in the automotive industry. The successful event not only brought great influence to TI's partner ecosystem but also played an important role in the development of embedded technology. Thanks to the impressive seminar, RF-star was pleased to forge new connections with industry experts and looked forward to working with TI partners to propel wireless technological innovation and expand more possible embedded applications. Click here for RF-star wireless modules RF-BM-2340x based on CC2340Rx. For more information, visit www.rfstariot.com or reach us by email address info@szrfstar.com. About RF-star Shenzhen RF-star Technology Co., Ltd (RF-star) is a leading global provider of wireless communication modules and solutions, specializing in low-power modules for IoT, industrial, automotive, and consumer appli...
RF-star Joins Car Connectivity Consortium to Accelerate UWB Digital Keys
Nov 21, 2023 RF-star Joins Car Connectivity Consortium to Accelerate UWB Digital Keys
Shenzhen, Guangdong, China, -Nov. 21, 2023 / -- RF-star, a leading provider of wireless module solutions, is pleased to announce its membership in the Car Connectivity Consortium (CCC) to further progress with the development of Bluetooth + Ultra Wide Band (UWB)+NFC digital keys for the automotive industry. In July 2022, the CCC launched the latest Digital Key Release 3 V 1.1. The universal cross-industry standard adds UWB in combination with Bluetooth® Low Energy connectivity and Near Field Communication (NFC) to have contactless, location-aware, and secure communication between smartphones and vehicles. RF-star, as a pioneer in wireless IoT technologies of BLE, UWB, NFC, ZigBee, Matter, Thread, Wi-SUN, etc. has been developing a complete set of automotive digital key solutions combined with the UWB, Bluetooth® Low Energy, and NFC technologies. UWB, a cutting-edge technology that utilizes radio waves to measure distances with extreme precision, is a key component of RF-star's digital key solutions. Integrated with UWB technology, the new solution based on its own automotive-grade chip modules not only ensures secure and reliable communication between smartphones and vehicles, but also enables advanced features such as accurate ranging and remote vehicle control. Since 2010, RF-star has been engaging in the wireless connectivity area, especially in BLE technology for more than 10 years. In former BLE PEPS solutions, RF-star several automotive-grade Bluetooth modules have been successfully installed into cars and mass-produced, such as low-power modules based on TI CC2642R-Q1. The previously released CC2340R5 module RF-BM-2340B1 and its subsequent CC2340 series modules are also suitable for digital key applications. This series of modules has made Bluetooth Low Energy car access antenna node reference design. Hence, RF-star's expertise in BLE technology and Bluetooth modules complements its UWB digital keys, easily achieving identity authentication, data interaction, and long-range positioning with ultra-low-power consumption. The combination of these technologies realizes a 40m-100m wake-up service and starts the engine with pinpoint accuracy within decimeter-level positioning. The introduction of UWB offers unparalleled convenience and security beyond today’s classic keys. What's more, as a new member of the Intelligent Car Connectivity Industry Ecosystem Alliance (ICCE) in the first half of the year, RF-star with major players had been fortunate to draft UWB System Requirements to advance the development of digital key systems. “With the implementation of the CCC digital key, the vehicle-to-device connectivity is imperative. It is a great honor to be a member of the CCC at this time and participate in the innovation of this wireless connectivity,” said King Kang, CEO of RF-star. “RF-star will propel unceasingly the development of the Internet of Vehicles industry and jointly build UWB ecosystem with global leading RF chipsets, carmakers...
RF-star CC2340R5 Bluetooth5.3 Low Energy ZigBee Modules Go Live on TI Site
Oct 26, 2023 RF-star CC2340R5 Bluetooth5.3 Low Energy ZigBee Modules Go Live on TI Site
RF-star, a leading global provider of IoT (Internet of Things) wireless solutions and wireless RF modules, is thrilled to announce that its CC2340R5 Bluetooth Zigbee modules have been officially listed on the Texas Instruments (TI) website and marketed around the globe. RF-star new products’ access to TI shows high recognition of its wireless modules again, further strengthening their longstanding partnership. Designing Low-Power Modules and Wireless Solutions Based on TI’s Chips RF-star launched the first BLE module in 2010 and has been TI's official IDH for over a decade. RF-star has created sustainable collaboration by developing CC2652 series (CC2652R, CC2652RB, CC2652P, CC2652R7 and CC2652P7) 2.4GHz RF modules and CC1352 series (CC1352R, CC1352P, CC1352R7 and CC1352P7) multi-band wireless modules. These modules respectively support multiple protocols like Zigbee, Thread, Bluetooth Low Energy, 6LoWPAN, MIOTY, Bluetooth mesh, Wi-SUN, and more. What’s more, the DMM (Dynamic Multiprotocol Management) enables the modules to work with different RF protocols simultaneously. They are widely used in IoT systems, medical devices, smart homes, sensor networks, industrial automation, smart grids, and remote controls. RF-star low-power Bluetooth modules and solutions based on the former generations of TI CC254x (CC2540 and CC2541), and CC264x (CC2640 and CC2642) chips can work in Bluetooth Low Energy serial port transparent transmission (bridge) protocols. The 2.4GHz BLE modules with UART port design can be regarded as a slave, a master, or a master-slave simultaneously, or a Beacon. The Bluetooth solutions greatly shorten the development circle and have won the favor of new energy vehicles, consumer electronics, health and medical equipment, sports and fitness, retail, and industrial applications. 5 RF-star CC2340R5 Bluetooth ZigBee Modules Are Available Now The CC2340R5 series listed on TI’s official website this time has 5 models. All of them are embedded with the UART transparent transmission protocol. The RF-BM-2340B1 (PCB antenna) and RF-BM-2340B1I (IPEX version) wireless modules have been announced as Pin-2-Pin compatible. They offer 24 GPIOs for rapid development and can be utilized as MCU modules with I2C, SPI, and UART peripheral applications. Their versatile applications range from medical and automobile to new energy and industrial sectors. Similarly, the RF-BM-2340A2 (PCB antenna) and RF-BM-2340A2I (IPEX version) modules are also Pin-2-Pin compatible. Featuring 12 GPIOs and a wide array of BLE5.2 serial port AT commands, these modules offer abundant possibilities. The small size and cost-competitive design make them suitable for various portable medical and consumer electronic applications. As for the RF-BM-2340C2 Bluetooth LE module with a chip antenna, it boasts a compact size of 8 mm × 8 mm. This ultra-compact module is specifically designed for applications that demand smaller dimensions and require shorter transmission ranges. Over...
Review on RF-star Exhibition at IOTE2023 in Shenzhen
Sep 25, 2023 Review on RF-star Exhibition at IOTE2023 in Shenzhen
On Sep. 22nd  2023, the 20th International Internet of Things Exhibition (IOTE 2023) was rounded off at Shenzhen World Expo Exhibition & Convention Center. As one of the exhibitors, RF-star presented a lineup of standout RF modules and advanced wireless IoT solutions, attracting masses of attendees from diverse industries to delve into our innovative solutions. Figure 1 RF-star Displayed Its Wireless Modules and IoT Applications At the exhibition, a series of wireless modules with BLE, Wi-Fi, ZigBee, Sub-1G, Thread, Matter and UWB protocols including CC2340, CC2530, CC2652, CC2651, CC1310, CC1312R, CC1352, EFR32BG22, EFR32BG24, EFR32MG24, nRF52810, nRF52832, nRF52840 series and the Bluetooth Beacon devices were on show. Besides, it focused on showcasing excellent IoT application solutions, eg. portable medical devices, Bluetooth PEPS, EV chargers, BMS, UWB digital key, and micro-inverters. The cutting-edge products and applications made a big splash in the IoT field. Figure 2 RF-star Team Shared Wireless Modules and Solutions RF-star's team engaged in extensive discussions and interactions with visitors at the exhibition. They showcased the stunning features and advanced technologies of RF-star products, along with use cases in various industries. The participants highly appreciated the rich function and high performance of RF-star's wireless solutions, leading to thought-provoking discussions. Figure 3 RF-star Marketing Director Leo Exchanged Ideas with Partners Furthermore, RF-star actively participated in productive discussions and dialogues with fellow exhibitors and industry partners. We shared the latest industry trends, challenges, and opportunities, explored the possibility of cooperation, and sought mutual growth. These interactions serve as a strong basis for forming solid partnerships in the future. The IOTE2023 exhibition came to an end, while IOT development never stops evolving. We would like to thank all visitors, partners, and staff for their support and attention. With the vision of “Wireless Creates Infinite Possibilities”, RF-star will keep up with IoT trends and technology, and continue to provide innovative wireless products and solutions to empower the Internet of Things industry to seamlessly connect with the world. About RF-star Shenzhen RF-star Technology Co., Ltd. (RF-star) is a leading supplier of wireless RF solutions and low-power modules with an excellent industry reputation and credibility. As the official third-party IDH of Texas Instruments for more than a decade and a trusted partner for customers worldwide, RF-star delivers expertise in design, manufacturing, production, and customized development. For more information, please contact us below: Website: www.rfstariot.com E-mail: info@szrfstar.com Social media: https://www.linkedin.com/company/shenzhen-rf-star-technology-co-ltd-/ https://www.youtube.com/channel/UCrnTUaX1HaoF9KMjFtWvr8Q https://www.facebook.com/szrfstars
RF-star to Join IOTE 2023 Shenzhen
Aug 23, 2023 RF-star to Join IOTE 2023 Shenzhen
Shenzhen RF-star Technology Co, Ltd. (RF-star), one of the world's top 3 wireless module manufacturers, will be an exhibitor in 2023 at the 20th International Internet of Things Exhibition (IOTE 2023). The event will be held at Shenzhen World Exhibition & Convention Centre (Baoan), China, from 20th to 22nd September. RF-star will be in Booth 10B13 and welcome all visitors coming to the booth to discover a variety of RF-star wireless RF products and innovative IoT solutions. IOTE 2023 is Asia's largest and most influential IoT expo. It exhibits the advanced technologies of RFID, IoT, sensor networks, wireless communication(like Bluetooth/ZigBee/UWB), smart retail and smart home, etc. RF-star’s CC2340 module is its new Bluetooth 5.3 LE ZigBee module - a device designed for ultra-low power wireless applications like smart homes, medical devices, industrial sensors, and automotive applications. As a forerunner in the wireless IoT arena, RF-star is invited to showcase its latest modules with BLE, WiFi, ZigBee, Sub-1G, Thread, Matter and UWB protocols including CC2340, CC2530, CC2652, CC2651, CC1310, CC1312R, CC1352, EFR32BG22, EFR32BG24, EFR32MG24, nRF52810, nRF52832, nRF52840 series, the Bluetooth Beacon devices. Besides, its excellent IoT applications integrated the cutting-edge wireless connectivity technology will also be displayed, covering portable medical devices (BGM, CGM and pulse oximeter), Bluetooth PEPS, EV charger, BMS, UWB digital key, micro-inverter, etc. With its advanced technology&instruments, experienced development teams, and global resources, RF-star is dedicated to providing easier and smarter wireless connectivity among different industries across the globe. Visitors attending the fair are welcome to visit our booth. For more information about the event, visit https://eng.iotexpo.com.cn/. For more information on RF-star products and solutions, email info@szrfstar.com, or visit www.rfstariot.com.
New CC2340 BLE Modules Enable Industries with High-Quality RF and Power Performance
Aug 17, 2023 New CC2340 BLE Modules Enable Industries with High-Quality RF and Power Performance
RF-star today rolled out its BLE module portfolio based on TI’s new CC2340 wireless microcontrollers (MCU) that enable high-quality Bluetooth® Low Energy (LE) modules much cheaper than the competing devices. Featuring top-ranking standby current and radio-frequency (RF) performance, the Bluetooth LE CC2340 modules are positioned for ultra-low power wireless applications, such as smart homes, medical devices, industrial sensors, and automobiles (like EV chargers and PEPS) at a lower price, making them affordable for engineers to add Bluetooth LE connectivity modules to more products. According to the 2023 Bluetooth Market Update released by the Bluetooth Special Interest Group (SIG), ABI Research anticipates a higher growth in the Bluetooth market over the next five years. By 2027, 7.6 billion Bluetooth-enabled devices will be shipping annually, representing a nine percent compound annual growth rate (CAGR). Driven by continued strong growth in peripheral devices, Bluetooth® LE single-mode device shipments are forecasted to more than double over the next five years. Figure 1 Single-Mode Bluetooth® LE Device Growth (numbers in billions) It follows that Bluetooth LE technology is still all the rage. As one of the Bluetooth SIG members, Texas Instruments is dedicated to Bluetooth technology to meet the growing demands for enhanced wireless connectivity in a wider range of applications. Last year, TI announced its fourth-generation Bluetooth LE Wireless MCUs, which is the CC2340 family featured with best-in-class standby current and ultra-low power radio-frequency (RF) performance. The CC2340 device family provides a highly integrated wireless connectivity function with support for Bluetooth 5.3 Low Energy, ZigBee, and proprietary 2.4GHz protocols. So far, the family has two latest ultra-low power additions: CC2340R5 and CC2340R2. The CC2340R2 MCU provides 256 KB Flash, 28 KB SRAM, and 12 I/O pads, while the advanced version ― CC2340R5 offers an in-system programmable flash of 512 KB, an ultra-low leakage SRAM of 36 KB, and up to 26 I/O pads. Additionally, both of them share the same MCU architecture to support OTA and a wide selection of peripherals communication interfaces such as UART, SPI, I2C, timer, temperature sensor, battery monitor, analog comparator, and ADC analog-to-digital converter, etc. Based on TI’s new-level wireless MCUs, RF-star CC2340 modules with high-quality RF and power performance will have a broad range of wireless connectivity applications, such as smart homes, medical, industrial sensors, and automobiles. Figure 2 CC2340R5 module series Let’s have a quick preview of the irresistible features of RF-star CC2340 modules. CC2340 Modules with High-Quality RF and Power Performance at An Affordable Price The CC2340 BLE modules have an industry-leading standby current of less than 710 nA, which is 40% lower than competing devices. Up to 10 years of service life on a coin cell battery can be ...
Blog
  • 27

    Aug, 2024

    Choosing Between Bluetooth LE Module and SoC: A Comprehensive Guide
    Choosing between a Bluetooth LE module and a System-on-Chip (SoC) is a critical but challenging decision in Bluetooth device design. Each option offers its own set of benefits and drawbacks, making it essential to carefully weigh performance, features, and costs. As a seasoned expert in Bluetooth technology, RF-star aims to simplify the decision-making process by providing an in-depth comparison of Bluetooth chipsets versus modules. This guide will help you to make the best choice based on your production volumes, technical expertise, budget, and time-to-market. What is a Bluetooth SoC ? A Bluetooth System-on-Chip (SoC) is an integrated circuit (IC) that facilitates Bluetooth communication within a device. It typically includes a core processor, RF transceiver, memory, and auxiliary circuits. The SoC serves as the heart of Bluetooth communication, managing data transmission and processing. What is a Bluetooth Module? In contrast, a BluetoothLE module is a pre-certified unit that acts as a comprehensive and low-power Bluetooth communication solution. It integrates a Bluetooth LE SoC with additional components such as RF circuits, crystal oscillators, antenna matching circuits, antennas, Balun, and peripheral interfaces on a printed circuit board (PCB). The module is a pre-packaged, plug-and-play solution that significantly simplifies product development, allowing developers to focus on higher-level product functionality without worrying about the underlying RF design. TI CC2340 SoC & RF-star RF-BM-2340B1 Module Samples Bluetooth LE Module vs. SoC: A Detailed Comparison We’ll use the following key metrics to compare the differences between Bluetooth LE module and SoC: Function Ease of use Application Cost 1. Functional Differences A Bluetooth SoC provides the essential functionalities for Bluetooth communication but requires additional peripheral components to create a fully operational system. Developers who choose a SoC must design and implement the necessary RF circuitry, power management, and embedded software. This level of customization is beneficial in situations when the product’s form factor, power consumption, and performance must be finely tuned. However, it also means that the development cycle will be longer, and the project may require a team with specialized expertise in RF design and embedded software development. Conversely, Bluetooth modules come with integrated peripheral RF circuitry and relevant embedded software, such as Bluetooth 5.0 serial port firmware, UART direct-driven firmware, SPI transparent transmission firmware, and I2C firmware. Developers can use an external MCU to control the Bluetooth connectivity directly, significantly reducing both the workload and complexity of product development. It allows developers to focus on the application layer and integrate Bluetooth connectivity into their products more quickly. If you know more Bluetooth serial port modules, check the blog Generic Serial Communi...
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    Choosing Between Bluetooth LE Module and SoC: A Comprehensive Guide
  • 24

    Jul, 2024

    Wi-SUN - A Priority for Large-Scale IoT Wireless Communication Networks
    Introduction The digital revolution has brought the Internet of Things (IoT) into the fabric of our daily lives. Wi-SUN technology, celebrated for its robust performance and versatile applications, has become a favored option for large-scale IoT implementations. This article explores the Wi-SUN technology market, its main benefits, use cases and applications, and RF-star’s implementation of Wi-SUN. Wi-SUN Technology Market Recent Wi-SUN Technology Market Research Report by Business Research Insight and Market Research Future indicate that the global Wi-SUN technology market, valued at USD 319.27 million in 2022, is predicted to reach USD 14.568 billion at a whopping 13.45% CAGR between 2024-2032. This surge is fueled by ongoing proliferation of smart meters, sensors, and IoT devices, as well as the accelerated digital transformation spurred by the COVID-19 pandemic. Notably, North America stands out as a region with significant adoption of Wi-SUN technology. Figure1:Wi-SUN Technology Market Size, 2023-2032 (USD Billion) Source: https://www.marketresearchfuture.com/reports/wi-sun-technology-market-8695 Wi-SUN Overview What is Wi-SUN? Wi-SUN, or Wireless Smart Ubiquitous Network, is a wireless communication network based on the IEEE 802.15.4 standard. It delivers a high-performance, low-power, long-range, robust anti-interference, high data throughput, and highly secure wireless communication solution. As a mesh network, it facilitates long-distance communication and high-data transmission between IoT devices through frequency-hopping and self-configuration technology. The network also features self-healing capability. Wi-SUN: HAN vs. FAN Wi-SUN supports two primary operational profiles: Home Area Network (HAN) and the Field Area Network (FAN): HAN: Home Area Network HAN currently has several types, including Router B and enhanced HAN (supporting relay transmission). Router B refers to the Home Energy Management System (HEMS) controller, connecting smart appliances and smart meters. It enables real-time monitoring of smart appliance energy consumption and communication with FAN for smart city applications, enhancing the smart home environment. FAN: Field Area Network Wi-SUN FAN is a mesh network where each device can establish multiple connections with nearby devices, scaling up to thousands of nodes. Each node provides typical long-distance hops. If an end-device fails to connect with another, it will automatically re-configure to an alternate path for other end-devices to the router node. This makes it ideal for large-scale infrastructure such as smart grids and streetlights. The Wi-SUN topology is illustrated below: Figure 2 Wi-SUN network topology Benefits of Wi-SUN Network Low Latency and High Data Throughput: Wi-SUN’s mesh topology, ensures a low-latency communication experience and supports high data throughput, catering to the demands of large-scale IoT deployments. Low Power Consumption: Wi-SUN devices typical...
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    Wi-SUN - A Priority for Large-Scale IoT Wireless Communication Networks

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