RF-star today rolled out its BLE module portfolio based on TI’s new CC2340 wireless microcontrollers (MCU) that enable high-quality Bluetooth® Low Energy (LE) modules much cheaper than the competing devices. Featuring top-ranking standby current and radio-frequency (RF) performance, the Bluetooth LE CC2340 modules are positioned for ultra-low power wireless applications, such as smart homes, medical devices, industrial sensors, and automobiles (like EV chargers and PEPS) at a lower price, making them affordable for engineers to add Bluetooth LE connectivity modules to more products.

According to the 2023 Bluetooth Market Update released by the Bluetooth Special Interest Group (SIG), ABI Research anticipates a higher growth in the Bluetooth market over the next five years. By 2027, 7.6 billion Bluetooth-enabled devices will be shipping annually, representing a nine percent compound annual growth rate (CAGR). Driven by continued strong growth in peripheral devices, Bluetooth® LE single-mode device shipments are forecasted to more than double over the next five years.

Figure 1 Single-Mode Bluetooth® LE Device Growth (numbers in billions)

It follows that Bluetooth LE technology is still all the rage.

As one of the Bluetooth SIG members, Texas Instruments is dedicated to Bluetooth technology to meet the growing demands for enhanced wireless connectivity in a wider range of applications. Last year, TI announced its fourth-generation Bluetooth LE Wireless MCUs, which is the CC2340 family featured with best-in-class standby current and ultra-low power radio-frequency (RF) performance.

The CC2340 device family provides a highly integrated wireless connectivity function with support for Bluetooth 5.3 Low Energy, ZigBee, and proprietary 2.4GHz protocols. So far, the family has two latest ultra-low power additions: CC2340R5 and CC2340R2.

The CC2340R2 MCU provides 256 KB Flash, 28 KB SRAM, and 12 I/O pads, while the advanced version ― CC2340R5 offers an in-system programmable flash of 512 KB, an ultra-low leakage SRAM of 36 KB, and up to 26 I/O pads. Additionally, both of them share the same MCU architecture to support OTA and a wide selection of peripherals communication interfaces such as UART, SPI, I2C, timer, temperature sensor, battery monitor, analog comparator, and ADC analog-to-digital converter, etc.

Based on TI’s new-level wireless MCUs, RF-star CC2340 modules with high-quality RF and power performance will have a broad range of wireless connectivity applications, such as smart homes, medical, industrial sensors, and automobiles.

Figure 2 CC2340R5 module series

Let’s have a quick preview of the irresistible features of RF-star CC2340 modules.

CC2340 Modules with High-Quality RF and Power Performance at An Affordable Price

The CC2340 BLE modules have an industry-leading standby current of less than 710 nA, which is 40% lower than competing devices. Up to 10 years of service life on a coin cell battery can be achieved in wireless applications such as electronic shelf labels and tire pressure monitoring systems (TPMS).

Meanwhile, the Bluetooth LE modules also allow engineers to expand RF performance and connection range with an output power of up to +8 dBm. The different RF output modes, such as half-hole ANT RF pin and IPEX connector, enable different needs of the applications with a wide range of choices on antennas.

Additionally, the CC2340 modules feature an integrated RF balun, enabling a simpler design with fewer external components. Hence, it is a piece of good news for those who are making use of a cost-effective strategy.

Even more, the CC2340 Bluetooth LE modules can operate over an industrial temperature range of -40ºC to 85ºC. Although these BLE modules are placed in complex and harsh working environments, they also ensure a highly stable and reliable wireless connection.

Figure 3 RF-BM-2340B1 Modules Features

What’s most important is the following CC2340 modules based on CC2340R5-Q1 meet the requirements of the Automotive Electronics Council (AEC)-Q100. The kind of Bluetooth LE module is quite suitable for automotive applications.

Tiny Size Is Good for Micro Integration Design

The CC2340 modules are smaller in size than ever before. The RF-BM-2340Ax BLE5.3 module based on CC2340R5 is available in a 16.6/15.2 mm × 11.2 mm stamp half-hole package, and the RF-BM-2340Cx module based on CC2340R2 may offer a tinier size with an 8 mm × 8 mm stamp half-hole package. The compact package and integrated balun easily help fit any space-constrained application design.

Broader Application of CC2340 Bluetooth LE Modules

With the increased memory, longer battery life, wider temperature range, and smaller size at a friendly price, engineers can adopt RF-star CC2340 modules to seamlessly connect everyday applications such as:

1. Automotive Industry: TPMS&PEPS Systems

No matter whether Tire Pressure Monitoring System (TPMS) or Passive Entry and Passive Start (PEPS) systems, you can benefit from these systems integrated with CC2340 modules:

• Support AEC-Q100 certification in the following plan.
• More than 10-year coin battery life with excellent power management.
• Support BLE long-range communication of coded physical layer (PHY).
• Up to +8 dBm of output power and industry-leading -102 dBm receiving sensitivity.
• Support various wake-up methods (timer, external GPIO wake-up).
• Compatible with mobile phone Bluetooth, providing compatibility test reports and related test tools accordingly.
• High-Security features such as safety induction with a trusted root.
• Meet the needs of the Internet of Vehicles (IoV).

Here you can learn how CC2340 BLE modules work in TPMS from the video.

2. Medical Device, Building Automation, and Consumer Electronics

Thanks to the CC2340 modules’ tiny package and ease of availability at a lower cost, they are very convenient for engineers to integrate RF-star BLE modules into more smart products. For example:

Medical devices: The friendly price, low power consumption, and RF performance of the CC2340 modules make them attractive for those designs such as CGM (continuous glucose monitor), insulin pumps, and medical sensor patches.

Building automation: Smart home hubs can take full advantage of up to +8 dBm of output power and the CC2340 modules supporting multiple protocols that include BLE 5.3, ZigBee 3.0, SimpleLink™TI 15.4-stack, and Proprietary systems.

Consumer Electronics: The compact size of the Bluetooth LE modules makes the final goods cuter and more fashionable. The extremely low power consumption enables long-term stable operation after one charge, and the affordable price offers a more enticing highlight for the daily products to integrate Bluetooth LE modules for intelligent functions.

Bluetooth LE Solutions to Fit Your Designs

RF-BM-2340B1, RF-BM-2340B1I, RF-BM-2340Ax, and RF-BM-2340Cx based on CC2340R5 and CC2340R2 MCUs are the latest members of our CC2340 modules family, which will serve the industrial, automotive and consumer electronics markets. For more information or CC2340 samples, see www.rfstariot.com or contact us at info@szrfstar.com.

About RF-star

RF-star has more than ten years of experience in the wireless RF field with the professional R&D team and has been engaging ourselves to provide global customers with high-quality wireless radio frequency solutions, embedded HW & SW designs, and ODM&OEM services. As a third-party IDH of Texas Instruments, RF-star will create innovation of Bluetooth LE technology and promote Bluetooth and multi-protocol products connected to more applications by the all-around support for TI’s fourth-generation CC2340 series MCUs.